Dana Uses Its Thermal Management Expertise To Protect Under-Hood Electronics in High Temperature Environments

Oct 21, 2002

    TOLEDO, Ohio, Oct. 21 /PRNewswire/ -- Convergence 2002, Booth # 520 --
Fried microchips, anyone?  Under-hood ambient temperatures of up to 300
degrees Fahrenheit create an environment where electronic components cannot
survive without dedicated and controlled cooling.  As more electronics are
applied in harsh under-hood environments, Dana Corporation's (NYSE: DCN)
Engine and Fluid Management Group is using its thermal management expertise to
develop new solutions to keep them operating.
    (Photo:  http://www.newscom.com/cgi-bin/prnh/19990903/DANA )
    "Dana's electric pump and heat exchanger developments address the growing
problem of protecting under-hood electronics," said Mike Laisure, president of
Dana's Engine and Fluid Management Group.  "The great thing about these
solutions is they apply to thermal management problems in internal combustion
engines, hybrids, and fuel cells, with little modification."
    Dana is developing a number of cooling pump and heat exchanger solutions
to manage heat effectively.  Where a cooling medium is readily available the
solution may be simple.  A recent example is a problem with an overheating
engine control unit that Dana solved for a large truck manufacturer, by
routing the fuel supply through the ECU, and creating a heat exchanger from
the aluminum casing.  This solution kept the electronic components below the
critical temperature ceiling.
    When a cooling medium is not available, or the problem comes from heat
soak after engine shut down, Dana has developed a range of electric pumps
using both microprocessor-controlled brushless DC motors and simple on/off
brushed motor devices.  Heat exchangers have been developed for the
independent cooling of ECU batteries, starter/alternator devices and electric
motors.  Dana can even offer a complete system solution to vehicle makers that
would include a heat exchanger, pump and fluid routing to address a particular
need.
    Dana also is positioned to offer robust thermal management solutions for
fuel cells, with pumps, heat exchangers and fluid routing for both the cooling
(water/glycol) and pure water circuits.
    Founded in 1904, Dana Corporation is a global leader in the design,
engineering, and manufacture of value-added products and systems for
automotive, commercial, and off-highway vehicle manufacturers and their
related aftermarkets.  The company employs approximately 70,000 people
worldwide, all dedicated to achieving innovation through close collaboration
with customers.  Based in Toledo, Ohio, Dana operates hundreds of technology,
manufacturing, and customer service facilities in 34 countries. The company
reported sales of $10.3 billion in 2001.

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SOURCE  Dana Corporation

Web site:  http: //www.dana.com

Photo:  http: //www.newscom.com/cgi-bin/prnh/19990903/DANA AP Archive:
http://photoarchive.ap.org PRN Photo Desk, 888-776-6555 or 212-782-2840

CONTACT: Jeff Cole of Dana Corporation, +1-419-787-6262, or jeff.cole@dana.com

Company News On-Call: http: //www.prnewswire.com/gh/cnoc/comp/226839.html

CAPTION: DANA    DANA CORPORATION LOGO    Dana Corporation logo.
(PRNewsFoto)[TC]    TOLEDO, OH USA    10/30/2001



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